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More Super Hard Products Co., Ltd Is One Of The Leading Company Expert In Supplying Various Ultra Hard Products Including Synthetic Diamond Tools, Cubic Boron Nitride(CBN) Tools, Which Is Widely Used
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Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel

More Super Hard tools company
More Super Hard tools company
Country/Region: China

Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel

Brand Name : more super hard
Model Number : 1A1 14A1
Certification : ISO9001
Place of Origin : CHINA
MOQ : 1pcs
Price : negotation
Payment Terms : L/C, D/A, D/P, T/T, Western Union
Supply Ability : 4000/months
Delivery Time : 5-10days
Packaging Details : box
material : diamond
bond : vitrified resin
gread : A B C
manufacture : yes
advantage : Long Working Life
application : For The Thinning And Fine Grinding Of The Silicon Wafer.
type : 6A2T
Email :
skype : Annawng
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Diamond Back Grinding Wheels

Diamond Back Grinding Wheels Are Used For Silicon Wafer Grinding. Our Advanced Technology Makes Back Grinding Wheel Possible To Grind All Types Of Semiconductor Wafers With Less Subsurface Damage.

During Grinding, The Grinding Wheel And The Wafer Rotate About Their Own Rotation Axes Simultaneously, And The Wheel Is Fed Towards The Wafer Along Its Axis. The Rotation Axis For The Grinding Wheel Is Offset By A Distance Of The Wheel Radius Relative To The Rotation Axis For The Wafer.

silicon wafer back grinding

Applications Of Back Grinding Wheels:

Back Thinning, Rough Grinding And Fine Grinding Of Silicon Wafer.

Workpiece Processed Include Silicon Wafer Of Discrete Devices, Integrated Chips (IC) And Virgin Etc.

Advantages Of Back Grinding Wheels:

Good Self-Dressing Ability, Long Life And Low Prices.

High Heat Conductivity, High Wear Resistance, And Low Coefficient.

It Is Highly Desirable That Grinding Wheels Generate Only Very Low Damage To Ground Wafers.

Applicable Grinding Machine:

The Back Grinding Wheels Can Be Used For The Japanese ,German, American, Korean And Other Grinders . Such As Okamoto , Disco, Strasbaugh And Others Grinding Machine.

The Specification Of Diamond Back Grinding Wheels:

ModelDiameter (Mm)Thickness (Mm)Hole (Mm)
6A2 back grinding wheels17530, 3576
6A2T back grinding wheels19522.5, 25170

6A2T back grinding wheels

6A2T (Three Ellipses)

Other Size Can Ba Made According To Customers Requirements Email:

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Back Grinding Wheels for Silicon Wafer,Diamond Backgrinding Wheel Images

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